PROBE CARD ENGINEER Job Hiring in Taiwan for SIGURD UTC CORP
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Job Vacancy: PROBE CARD ENGINEER
Principal/Employer: SIGURD UTC CORP
DMW Accreditation No: 10467599
Job Location: Taiwan
PROBE CARD ENGINEER
Qualifications:
- Bachelor’s Degree in Computer Engineering, Telecommunications Engineering, or a related engineering field
- Minimum 1 year of relevant working experience
- Experience in the semiconductor industry, particularly in probe card repair and maintenance
- Knowledge and hands-on experience in:
- Probe card cleaning and sanding
- Needle adjustment and replacement
- Pin changing and maintenance
- PRVX operation
- Experience using microscopes for inspection and repair activities
- Strong troubleshooting and analytical skills
- Knowledge of semiconductor testing processes and equipment maintenance
- Familiarity with ISO standards, safety procedures, and information security practices
Responsibilities:
- Perform probe card preventive maintenance (PM) and repair activities
- Monitor and improve probe card cycle time and operational efficiency
- Conduct probe card troubleshooting, inspection, and repair
- Support product testing analysis and process improvement activities
- Maintain probe card machines and related test equipment
- Perform needle alignment, adjustment, replacement, and cleaning operations
- Train and assist new staff on probe card handling and maintenance procedures
- Use microscopes and precision tools for inspection and repair work
- Support ISO compliance, workplace safety, hygiene, and information security requirements
- Prepare maintenance records, reports, and documentation related to equipment operations
Requirements:
- Update and detailed Resume in Word format or PDF with a picture
- Employment Certificate
- Training Certificate
- Passport Copy
Walk-in applicants are welcome to apply!
Visit our office for personal Pre-Screening at:
Fil-Sino Manpower Services, Inc.
📍No. 27 Rainbow St., Bricktown Subdivision, Moonwalk, Paranaque City
Employer Overview:
Founded in 1988, Sigurd Corporation is an outsourced supplier of semiconductor assembly and test services (OSAT). The management team has an average of over 30 years of experience in semiconductor packaging and testing.
The group possesses the most advanced technology, equipment, and automated production lines in the market, distributed across Taiwan, China, and Japan. With a global customer base, the group provides comprehensive backend semiconductor manufacturing services. Sigurd Corporation has over 2,000 testers, offering professional wafer probe and IC final test. Utilizing these sophisticated testing equipment and techniques, the company stands out as an independent OSAT provider offering unified IC test services.
Sigurd’s package services include Wafer Level Chip Scale Packaging (WLCSP), Bumping, Flip Chip, and Window Ball Grid Array (wBGA). The test services cover both standard and customized test solutions, encompassing logic, analog, mixed-signal, RF, memory, and power wafer and IC final test. Semiconductors packaged and tested by Sigurd are widely applied in various fields such as the metaverse, high-performance computing, wireless communication, mobile devices, automotive, medical, satellite, computers, IoT, artificial intelligence, consumer electronics, and multimedia products.
For manpower pooling only
No fees in any form and/or purpose will be collected from the applicants.
Beware of illegal recruiters and Human Trafficker.
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