CHIP BOARD EQUIPMENT ENGINEER Job Hiring in Taiwan for SIGURD UTC CORP
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Job Vacancy: CHIP BOARD EQUIPMENT ENGINEER
Principal/Employer: SIGURD UTC CORP
DMW Accreditation No: 10467599
Job Location: Taiwan
CHIP BOARD EQUIPMENT ENGINEER
Qualifications:
- Minimum 1 year of relevant working experience
- No minimum educational attainment required
- Experience in production line equipment operation, setup, maintenance, and troubleshooting
- Experience with semiconductor testing equipment, particularly:
- Advantest V93000
- Advantest EXA Platform
- Teradyne UFLEX
- Teradyne UFLEX Plus
- Experience in operation, maintenance, and setup of TEL Prober Equipment, including:
- PRECIO
- PROCIO XL
- PREXIA
- Strong analytical and troubleshooting skills
- Ability to identify equipment abnormalities and implement corrective actions
- Knowledge of preventive maintenance procedures and equipment reliability improvement
Responsibilities:
- Perform production line equipment setup, troubleshooting, and fault repairs
- Conduct regular maintenance and preventive maintenance of production equipment
- Monitor equipment performance and ensure smooth manufacturing operations
- Analyze equipment abnormalities and implement corrective and preventive actions
- Track equipment issues through resolution and continuous improvement activities
- Support equipment optimization and process improvement projects
- Maintain equipment documentation, maintenance records, and technical reports
- Coordinate with production and engineering teams to minimize downtime
- Ensure equipment operates according to quality, safety, and production requirements
- Assist in installation, calibration, and qualification of semiconductor equipment
Requirements:
- Update and detailed Resume in Word format or PDF with a picture
- Employment Certificate
- Training Certificate
- Passport Copy
Walk-in applicants are welcome to apply!
Visit our office for personal Pre-Screening at:
Fil-Sino Manpower Services, Inc.
📍No. 27 Rainbow St., Bricktown Subdivision, Moonwalk, Paranaque City
Employer Overview:
Founded in 1988, Sigurd Corporation is an outsourced supplier of semiconductor assembly and test services (OSAT). The management team has an average of over 30 years of experience in semiconductor packaging and testing.
The group possesses the most advanced technology, equipment, and automated production lines in the market, distributed across Taiwan, China, and Japan. With a global customer base, the group provides comprehensive backend semiconductor manufacturing services. Sigurd Corporation has over 2,000 testers, offering professional wafer probe and IC final test. Utilizing these sophisticated testing equipment and techniques, the company stands out as an independent OSAT provider offering unified IC test services.
Sigurd’s package services include Wafer Level Chip Scale Packaging (WLCSP), Bumping, Flip Chip, and Window Ball Grid Array (wBGA). The test services cover both standard and customized test solutions, encompassing logic, analog, mixed-signal, RF, memory, and power wafer and IC final test. Semiconductors packaged and tested by Sigurd are widely applied in various fields such as the metaverse, high-performance computing, wireless communication, mobile devices, automotive, medical, satellite, computers, IoT, artificial intelligence, consumer electronics, and multimedia products.
For manpower pooling only
No fees in any form and/or purpose will be collected from the applicants.
Beware of illegal recruiters and Human Trafficker.
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