DIE ATTACH SECTION HEAD Job Hiring in Malaysia for ASE Electronics (M) Sdn. Bhd.
Jobs Abroad
Job Opportunity in Malaysia!
Job Vacancy: DIE ATTACH SECTION HEAD
Employer/Company: ASE Electronics (M) Sdn. Bhd.
Job Location: Penang, Malaysia
DIE ATTACH SECTION HEAD
Qualifications:
- Experience in Semiconductor industry is an advantage
- ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)
- Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
Responsibilities:
- Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
- Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost
- Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
- Manage of spare parts for equipment and repair of damage parts. 7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
- Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
Requirements:
- Update RESUME with detailed job description
- Certificate of Employment (COE)
- Training Certificate
- Valid passport
- Diploma & TOR
- PEOS, E-REG, POEA info sheet
If you are passionate about your work and ready for a new challenge, we want to hear from you!
Visit our office for an initial interview:
JobsConnect Manpower Agency, Inc.
Unit 1102, 1103 & 1104 The One Executive Office, West Avenue, Quezon City
Unit 2C 2nd Flr. STL Ventures Realty Bldg. Lacson Street, Brgy. 18-B BO. Obrero Davao City
Interested applicants may call and inquire further details:
For Inquiries: Reach out to our dedicated team:
Dianne – 0930 671 7723 (MNL)
Ana – 09105527872 (MNL)
Linda- 09688802544 (MNL)
Mhel – 0968 880 2542, Jcmai Davao
0910 552 7943 / 0951 373 1179 [/content_control]
Employer Overview:
ASE Electronics (M) Sdn. Bhd. was established in 1991 and located in Penang, Malaysia.
We are a semiconductor manufacturing service provider of assembly packaging and testing solutions to global semiconductor companies.
ASE Malaysia is part of Advanced Semiconductor Engineering (ASE) Group, the world’s largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader, ASE provides a complete scope of services for the semiconductor market; driven by superior technologies, breakthrough innovations, and advanced development program.
For manpower pooling only
No fees in any form and/or purpose will be collected from the applicants.
Beware of illegal recruiters and Human Trafficker.
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DIE ATTACH SECTION HEAD Job Hiring in Malaysia for ASE Electronics (M) Sdn. Bhd.
Qualifications:
Experience in Semiconductor industry is an advantage
ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)
Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
Responsibilities:
Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost
Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
Manage of spare parts for equipment and repair of damage parts. 7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
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