ASSISTANT ENGINEER Job Hiring in Taiwan for ASE Chungli
Jobs Abroad
Career Opportunities in Taiwan!
Job Vacancy: ASSISTANT ENGINEER
Employer/Company: Advanced Semiconductor Engineering (ASE Chungli Branch)
DMW Accreditation No.: 10111299
Job Location: Taiwan
ASSISTANT ENGINEER
Qualifications:
- Previous experience in a semiconductor manufacturing company is required.
- Hands-on experience in one or more of the following semiconductor process stations:
- Die Bond
- Grinding
- Heat Sink
- Flip Chip / Underfill
- Wafer Saw / Singulation
- Mold
- Laser Mark
- Open Short
- SBBP (Solder Ball Ball Placement / Ball Mount)
- Experience in the maintenance and troubleshooting of Final Test (FT) equipment.
- Knowledge of Advantest and Teradyne semiconductor testers and FT handler equipment.
- Strong understanding of semiconductor assembly, packaging, testing, and equipment maintenance.
- Ability to read technical manuals, schematics, and engineering documentation.
- Strong analytical, troubleshooting, and problem-solving skills.
- Excellent communication and teamwork abilities.
- Willing to work in a cleanroom environment, shifting schedules, and overtime when required.
Responsibilities:
- Perform preventive and corrective maintenance on semiconductor production equipment to ensure maximum machine availability and production efficiency.
- Troubleshoot and repair equipment issues affecting semiconductor assembly, packaging, and final testing operations.
- Support production lines in the following process stations:
- Die Bond
- Grinding
- Heat Sink
- Flip Chip / Underfill
- Wafer Saw / Singulation
- Mold
- Laser Mark
- Open Short Inspection
- SBBP (Solder Ball Ball Placement / Ball Mount)
- Set up, calibrate, and optimize production equipment to meet manufacturing specifications.
- Maintain and troubleshoot Final Test (FT) equipment, including semiconductor testers and handlers.
- Operate and support Advantest and Teradyne testing platforms and associated FT handler equipment.
- Diagnose electrical, mechanical, pneumatic, and control system issues to minimize equipment downtime.
- Monitor equipment performance and implement improvements to enhance productivity and product quality.
- Perform equipment qualification, verification, and documentation following company procedures.
- Maintain accurate maintenance records, repair logs, and technical reports.
- Collaborate with production, process, quality, and engineering teams to resolve manufacturing issues.
- Follow cleanroom protocols, ESD (Electrostatic Discharge) procedures, and workplace safety standards.
- Participate in continuous improvement initiatives to improve equipment reliability and manufacturing efficiency.
Requirements:
- Update and detailed Resume in Word format or PDF with a picture
- Employment Certificate
- Training Certificate
- Passport Copy
IF INTERESTED PLS Report 9AM for Pre-screening & Interview Line up. LOOK FOR MS. MAGIE
Walk-in applicants are welcome to apply!
Visit our office for personal Pre-Screening at:
Fil-Sino Manpower Services, Inc.
📍No. 27 Rainbow St., Bricktown Subdivision, Moonwalk, Paranaque City
Employer Overview:
ASE ChungLi (ASECL), a member of the ASE Group, delivers comprehensive semiconductor manufacturing services, including engineering test, package design, IC assembly, wafer probing, final test, and design manufacturing services (DMS).
With advanced technologies and vast capacity, ASECL provides industry-leading backend manufacturing services at its Intelligible Park facility in ChungLi. Our turnkey services encompass a wide variety of backend processes, including IC test program design, front-end engineering test, substrate and package design, substrate manufacturing, as well as package tooling during the wafer fabrication process. These services are complemented by ASECL’s seamless logistics management, evident throughout all stages, and ultimately responsible for driving down cycle times and increasing efficiency.
ASECL possesses expertise in product and process technology, essential for the development of leading-edge packages including Chip Scale Packages (CSP), Multi Chip Modules (MCM), thermally enhanced packages, flip chip packages, and memory.
Located in the heart of Taiwan’s semiconductor cluster, ASECL leverages its prime location to serve both fabless companies and integrated device manufacturers (IDMs), who cater to the expanding consumer, computer, and communications markets.
For manpower pooling only
No fees in any form and/or purpose will be collected from the applicants.
Beware of illegal recruiters and Human Trafficker.
- This job has expired!
Related Jobs
New Job Alert
Never miss a chance!
Let us know your job expectations, so we can find you jobs better!